Applied Sciences | Free Full-Text | Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock
Microsection | BGA Cross Section Analysis
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？ | I am a Manufacturing Process Engineer (MPE)
The intermetallic layer of solder joints: a) Infrared heating method, | Download Scientific Diagram
The Role of Aluminium in Continuous Galvanizing - Ark Novin
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints | I am a Manufacturing Process Engineer (MPE)
Cross-Sectional Analysis — Elmet
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
Why perform cross-sectional evaluation of circuit boards (PCB)? | Element
Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text
Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders
The cross sections of the as-diffusion alloyed intermetallic layer... | Download Scientific Diagram
Cross-Sectional Analysis — Elmet
Cross-section BSE images of the interfacial IMC layers before assembly:... | Download Scientific Diagram
Hurtony Tamás
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
Microsection / Cross-Section Analysis
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Gold–aluminium intermetallic - Wikipedia
Figure 2 from Investigation of the wetting properties of Cu6Sn5 intermetallic compound | Semantic Scholar
BGA Solder Joint Microsection - SEM Lab Inc.
Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology - ScienceDirect
Materials | Free Full-Text | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
Effect of shape-memory alloy NiTi fiber on microstructure and mechanical properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan, Chunfa Lin, Zhilei Zhao, Xuecong
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging | Scientific Reports
